Massive compute capabilities enable a whole new way of manipulating and using data, and a potential bonanza for AI data ...

Automatic Discovery of User-exploitable Architectural Security Vulnerabilities in Closed-Source RISC-V CPUs” was published by ...

A new technical paper titled “A nanolaser with extreme dielectric confinement” was published by researchers at Technical ...

A new technical paper “High Pressure and Compositionally Directed Route to a Hexagonal GeSn Alloy Class” was published by researchers at the University of Edinburgh, GFZ Helmholtz Centre for ...

To fill the talent gap, CS majors could be taught to design hardware, and the EE curriculum could be adapted or even shortened.

The acceleration of technology s unprecedented: AI data centers, edge build-out, robotics, photonics, quantum, multi-die assemblies. Semiconductor Engineering Editor in Chief Ed Sperling talks with ...

Proposed as an alternative to chemical mechanical polishing (CMP), in which abrasive particles are dispersed in liquid, the method uses vertically aligned carbon nanotubes fixed in polyurethane and ...

KAIST researchers published “Carbon nanotube sandpaper for atomic-precision surface finishing.” Abstract “Sandpapers, also ...

Edge MLIR HLS framework.” Abstract “Driven by the increasing demand for low-latency and real-time processing, machine ...

How much of the energy consumed in an AI chip is spent doing something useful? This question affects everything from software ...

This integration addresses the fundamental barriers that have historically limited formal verification adoption: complexity ...

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...